Silicone Thermal Pad for Heat Transfer/Low Thermal Resistance
Our company (Tensan) produces high-adhesion thermal conductive silicone pad, which was mainly used in low fastening pressure applications. Low modulus polymers attached to fiberglass substrates, Between the machine's contact surfaces it can be used as a fill interface. High adhesion and low hardness, enhanced voltage breakdown, good electrical insulation, to meet the ROHS and UL environmental requirements. It is with high thermal conductivity, and made of fiberglass cloth thermal silicone pad, mainly used for heating devices and heat sink or heat conduction for product shells without fastening device.
Features & Benefits:
- REACH, ROHS certified
- MSDS for air/sea shipment
- High thermal conductivity, low thermal resistance
- Excellent insulation performance;
- Good surface wetting;
- Good resilience, reliable long-term duration
Typical Properties
Property/Model | ASTM | Unit | TS100 | TS150 | TS200 | TS300 |
Color | Visual | ...... | grey | grey | grey | grey |
Thickness | D374 | mm | 0.5-8 | 0.5-8 | 0.5-8 | 0.5-8 |
Specific Gravity | D792 | g/cc | 2.4 | 2.1 | 2.5 | 2.6 |
Hardness | D2240 | shore 00 | 35 | 30 | 30 | 30 |
Breakdown Voltage | D149 | kv@1mm | >6 | >6 | >6 | >6 |
Volume Resistivity | D257 | Ω-cm | 9.6x10^12 | 9.6x10^12 | 9.6x10^12 | 9.6x10^12 |
Flame Rating | UL94 | v-0 | v-0 | v-0 | v-0 | |
Thermal impedence | Thermal conductivity | ºC-in^2/W | 1.08 | 1.1 | 0.96 | 0.8 |
Thermal Conductivity | D5470 | W/m.K | 1.0 | 1.5 | 2.0 | 3.0 |
Appliaction
- High power Electrical appliances power supply
- LED lighting, lighting equipment
- Household appliances, LCD monitors
- Between the semiconductor and the heat sink
- Communications products, smart phones, tablet PCs
- Desktop computers, notebooks and other portable computers
Storage and Validity
Shelf life:18 months;
Storage conditions: Cool and dry place (5ºC<T<30ºC); Relative humidity: RH<70%
Product